NTMET

Dead / Abandoned — Abandoned — no statement of use filed (as of 13 Apr 2026)

What this means for you

This application is over — abandoned 13 Apr 2026. The name may be available, but check before relying on it — rights can also come from actual use, not only from the register.

Record

Serial number
90557730
Mark type
Word mark
Filed
03 Mar 2021
Published for opposition
10 Jan 2023
Abandoned
13 Apr 2026
Attorney of record
SUSAN A. RUSSELL, ESQ.

Goods and services

  • Class 001 — Chemicals: copper (I) oxide and copper (II) oxide ultrafine powders and compounds for use as additives in the manufacture of catalysts, superconducting materials, thermoelectric materials, sensing materials, antifouling paints, glass, ceramics; copper (I) oxide and copper (II) oxide ultrafine powders and compounds for use as additives for industrial use; suspensions of copper ultrafine particles for use in the manufacture of sintering additives for micro-powder injection moulding (PIM), antimicrobial, and anti-fungal agent, nano-metal lubricant additives, catalysts for chemical reactions, conductive inks and pastes, antifouling paints, friction material, EMC and RFI shielding paints; suspensions of copper ultrafine particles for industrial use; chemical additives, namely, powders of copper (I) oxide, copper (II) oxide, for use in the manufacture of sintering additives for micro-powder injection moulding (PIM), antimicrobial, and anti-fungal agent, nano-metal lubricant additives, catalysts for chemical reactions, conductive inks and pastes, antifouling paints, friction material, EMC and RFI shielding paints; chemical additives, namely, powders of copper (I) oxide, copper (II) oxide, for the biomedical industry; nanopowders for industrial purposes; chemical compounds for use in patterning at nano scale or near nano scale; specialty chemicals, namely, chemical additives for general industrial use in the manufacture of a wide variety of goods
  • Class 006 — Metal goods: ultrafine copper particles for use in dispersions used in the manufacture of sintering additives for micro-powder injection moulding (PIM), antimicrobial, and anti-fungal agent, nano-metal lubricant additives, catalysts for chemical reactions, conductive inks and pastes, antifouling paints, friction material, EMC and RFI shielding paints; Ultrafine copper particles for use in dispersions for industrial use; silver-coated copper powders for use in the manufacture of sintering additives for micro-powder injection moulding (PIM), antimicrobial, and anti-fungal agent, nano-metal lubricant additives, catalysts for chemical reactions, conductive inks and pastes, antifouling paints, friction material, EMC and RFI shielding paints

Owner

Board proceedings on this mark

Prosecution history

  • 13 Apr 2026 — ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED
  • 13 Apr 2026 — ABANDONMENT - NO USE STATEMENT FILED
  • 13 Nov 2025 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
  • 13 Nov 2025 — SOU EXTENSION 5 GRANTED
  • 30 Jul 2025 — SOU EXTENSION 5 FILED
  • 12 Nov 2025 — CASE ASSIGNED TO INTENT TO USE PARALEGAL
  • 30 Jul 2025 — SOU TEAS EXTENSION RECEIVED
  • 29 Apr 2025 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
  • 29 Apr 2025 — SOU EXTENSION 4 GRANTED
  • 31 Jan 2025 — SOU EXTENSION 4 FILED
  • 31 Jan 2025 — SOU TEAS EXTENSION RECEIVED
  • 24 Jul 2024 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
  • 24 Jul 2024 — SOU EXTENSION 3 GRANTED
  • 16 Jul 2024 — SOU EXTENSION 3 FILED
  • 16 Jul 2024 — SOU TEAS EXTENSION RECEIVED

View this trademark record on Rightsy