CUPRIMA
Live / Allowed — Publication / registration review complete (as of 14 Oct 2026)
What this means for you
Approved and waiting on proof of use. It will register unless the applicant drops it, and its 30 Mar 2026 filing date already counts against anyone who files later.
Record
- Serial number
- 79452201
- Mark type
- Word mark
- Filed
- 30 Mar 2026
- Published for opposition
- 03 Nov 2026
- Attorney of record
- Constance B. Stefanou
Goods and services
- Class 001 — Chemicals: Adhesives for use in the manufacture of electronic components; tacking agent, namely, temporary fixing adhesives in the nature of temporary adhesives for industrial purposes; tacking agent, namely, temporary fixing adhesives for industrial use; temporary fixing adhesives used for electronic components, namely, temporary adhesives for use in manufacturing electronic components; temporary fixing adhesives for use in the manufacture of semiconductors; temporary fixing adhesives used for temporary binding semiconductor chips in assembly processes of electronic components and semiconductors, namely, temporary fixing adhesives for use in the manufacture of electronic components and semiconductors
- Class 006 — Metal goods: Solder pastes, namely, powder of copper in the form of pastes used in bonding and sintering processes of electronic components; solder preforms, namely, copper preforms used in bonding and sintering processes of electronic components; semi-processed copper used in bonding and sintering processes of electronic components; solder pastes, namely, powder of copper in the form of pastes used as a bonding material for electronic components such as power semiconductors; solder preforms, namely, copper preforms used as a bonding material for electronic components such as power semiconductors; semi-processed copper used as a bonding material for electronic components such as power semiconductors; copper and its alloys in the form of pastes used for sintering in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for die attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of sheets used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; solder preforms, namely, preforms of copper and copper alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; semi-processed copper and its alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for die attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates on printed circuit boards in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in manufacturing processes of electronic components such as power semiconductors; solder pastes, namely, powder of copper in the form of pastes used for sinter joining
Owner
Prosecution history
- 08 Oct 2026 — REFUSAL PROCESSED BY IB
- 05 Oct 2026 — APPROVED FOR PUB - PRINCIPAL REGISTER
- 01 Oct 2026 — TEAS/EMAIL CORRESPONDENCE ENTERED
- 01 Oct 2026 — CORRESPONDENCE RECEIVED IN LAW OFFICE
- 01 Oct 2026 — TEAS RESPONSE TO OFFICE ACTION RECEIVED
- 21 Sept 2026 — NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
- 21 Sept 2026 — REFUSAL PROCESSED BY MPU
- 17 Jul 2026 — NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
- 16 Jul 2026 — NON-FINAL ACTION WRITTEN
- 13 Jul 2026 — ASSIGNED TO EXAMINER
- 30 Jun 2026 — APPLICATION FILING RECEIPT MAILED
- 30 Jun 2026 — NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
- 30 Jun 2026 — LIMITATION FROM ORIGINAL APPLICATION ENTERED
- 18 Jun 2026 — SN ASSIGNED FOR SECT 66A APPL FROM IB