ADTECH CERAMICS

Live / Registered — Registered and renewed (as of 28 Sept 2016)

What this means for you

Registered since 05 Jun 2007. The owner can stop confusingly similar uses in the classes it covers; it stays on the register as long as the owner keeps up the maintenance filings (the §8 & §9 renewal is due by 05 Jun 2027, and its filing window is open now).

Record

Serial number
78538024
Registration number
3248940
Mark type
Design + words
Filed
23 Dec 2004
Published for opposition
20 Mar 2007
Registered
05 Jun 2007
Current term from
05 Jun 2017
Next maintenance filing
§8 & §9 renewal, due by 05 Jun 2027 (grace period to 05 Dec 2027)
Attorney of record
Jeffrey L. Van Hoosear

Goods and services

  • Class 001 — Chemicals: CERAMIC COMPOSITIONS IN THE SOLID STATE FOR MANUFACTURE OF ALUMINA HIGH TEMPERATURE COFIRED CERAMIC (HTCC) AND LOW TEMPERATURE CO-FIRE CERAMIC (LTCC); ALUMINUM NITRIDE (AIN) FOR USE IN THE MANUFACTURE OF CERAMIC ELECTRONIC COMPONENTS; CERAMIC COMPOSITIONS IN THE SOLID STATE FOR MANUFACTURE OF CERAMIC ELECTRONIC COMPONENTS, NAMELY, NON-METAL CERAMIC SUBSTRATES
  • Class 009 — Scientific and electric apparatus: CERAMIC AND METAL ELECTRONIC COMPONENTS, NAMELY, SINGLE AND MULTI-LAYER CO-FIRE CERAMIC PACKAGES, CERAMIC PACKAGES, CERAMIC PACKAGING, MULTI LAYER CERAMICS AND BRAZED ASSEMBLIES THEREFOR ALL FOR MICRO ELECTRONIC HIGH RELIABILITY APPLICATIONS FOR USE IN COMBINATION WITH MICROCHIPS, RESISTORS AND CAPACITORS; CERAMIC CHIP SCALE PACKAGING, NAMELY, INTEGRATED CIRCUIT PACKAGES THAT CONTACT PADS INSTEAD OF PINS OR WIRES; CERAMIC PIN GRID ARRAYS AND CERAMIC BALL GRID ARRAYS ALL IN THE NATURE OF CONFIGURATIONS FOR MICROPROCESSOR SOCKETS ON COMPUTER MOTHERBOARDS; MULTI CHIP INTEGRATED CIRCUIT MODULES; FEEDTHROUGHS, NAMELY, CERAMIC CO-FIRED CONDUCTORS HERMETICALLY CONNECTING TWO CIRCUITS ON OPPOSITE SIDES OF A METAL HOUSING; HEAT SPREADERS FOR REMOVING HEAT FROM HIGH POWER DEVICES IN A CERAMIC PACKAGE; LEADLESS CERAMIC CHIP CARRIERS, NAMELY, SEMICONDUCTOR CHIP HOUSINGS; BRAZED METAL ELECTRONIC ASSEMBLIES, NAMELY, QUAD FLAT PACKS AND DUAL IN-LINE PACKAGES FOR USE WITH INTEGRATED CIRCUITS

Owner

Board proceedings on this mark

Prosecution history

  • 05 Jun 2026 — COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
  • 28 Sept 2016 — NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
  • 28 Sept 2016 — REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
  • 28 Sept 2016 — REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
  • 28 Sept 2016 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
  • 11 Jul 2016 — TEAS SECTION 8 & 9 RECEIVED
  • 05 Jun 2016 — COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
  • 09 Jul 2012 — NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
  • 08 Jul 2012 — REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
  • 08 Jul 2012 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
  • 29 Jun 2012 — TEAS SECTION 8 & 15 RECEIVED
  • 05 Jun 2007 — EXPARTE APPEAL TERMINATED
  • 05 Jun 2007 — REGISTERED-PRINCIPAL REGISTER
  • 20 Mar 2007 — PUBLISHED FOR OPPOSITION
  • 28 Feb 2007 — NOTICE OF PUBLICATION

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